Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies

ABSTRACT

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

CROSS-REFERENCE TO RELATED APPLICATION(S)

The present application claims priority to and the benefit ofProvisional Application No. 61/351,253, filed Jun. 3, 2010, entitled“METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING INTERNAL STACKEDMICRO VIAS TO COUPLE SUBASSEMBLIES”, the entire content of which isincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates generally to printed circuit boards andmethods of manufacturing the same, and more particularly, to printedcircuit boards having circuit layers laminated with blind and internalmicro via(s) and methods of manufacturing the same.

BACKGROUND

Most electronic systems include printed circuit boards with high densityelectronic interconnections. A printed circuit board (PCB) may includeone or more circuit cores, substrates, or carriers. In one fabricationscheme for the printed circuit board having the one or more circuitcarriers, electronic circuitries (e.g., pads, electronic interconnects,etc.) are fabricated onto opposite sides of an individual circuitcarrier to form a pair of circuit layers. These circuit layer pairs ofthe circuit board may then be physically and electronically joined toform the printed circuit board by fabricating an adhesive (or a prepregor a bond ply), stacking the circuit layer pairs and the adhesives in apress, curing the resulting circuit board structure, drillingthrough-holes, and then plating the through-holes with a copper materialto interconnect the circuit layer pairs.

The curing process is used to cure the adhesives to provide forpermanent physical bonding of the circuit board structure. However, theadhesives generally shrink significantly during the curing process. Theshrinkage combined with the later through-hole drilling and platingprocesses can cause considerable stress into the overall structure,leading to damage or unreliable interconnection or bonding between thecircuit layers. Thus, there is a need for material and associatedprocesses which can compensate for this shrinkage and can provide for amore stress-free and reliable electronic interconnection between thecircuit layer pairs.

In addition, the plating of the through-holes (or vias) with the coppermaterial requires an additional, expensive, and time consuming processsequence that is difficult to implement with a quick turnaround. FIG. 1is a flowchart of a sequential lamination process for manufacturing aprinted circuit board having stacked vias including expensive and timeconsuming sequential lamination and plating steps. Thus, there is a needto provide for a printed circuit board and a method of manufacturing thesame that can be quickly and easily fabricated and/or ensure alignmentof the interconnections (or through-holes or micro vias) on the printedcircuit board by reducing iterations of key processes to thereby reducemanufacturing time and cost.

SUMMARY

Aspects of embodiments of the invention relate and are directed tosystems and methods of manufacturing printed circuit boards using blindand internal micro vias to couple subassemblies. An embodiment of theinvention provides a method of manufacturing a printed circuit includingattaching a plurality of metal layer carriers to form a firstsubassembly including at least one copper foil pad on a first surface,applying an encapsulation material onto the first surface of the firstsubassembly, curing the encapsulation material and the firstsubassembly; applying a lamination adhesive to a surface of the curedencapsulation material, forming at least one via in the laminationadhesive and the cured encapsulation material to expose the at least onecopper foil pad, attaching a plurality of metal layer carriers to form asecond subassembly, and attaching the first subassembly and the secondsubassembly.

Another embodiment of the invention provides a method of manufacturing amulti-layer printed circuit board including forming a first subassemblyincluding (a) attaching at least one metal layer carrier to form a firstsubassembly including at least one copper foil pad on a first surface,(b) applying an encapsulation material onto the first surface of thefirst subassembly, (c) curing the encapsulation material and the firstsubassembly, (d) forming at least one first via in the curedencapsulation material to expose the at least one copper foil pad, (e)forming a conductive pattern on a surface of the cured encapsulationmaterial, the conductive pattern including a conductive pad coupled tothe at least one first via, (f) applying a lamination adhesive to thesurface of the cured encapsulation material, (g) forming at least onehole in the lamination adhesive proximate the at least one first via,(h) filling the at least one hole with a conductive material to form atleast one second via, repeating (a) through (e) to form a secondsubassembly, attaching the first subassembly and the second subassemblysuch that the at least one second via of the first subassembly is aboutaligned with the conductive pad of the second subassembly.

Yet another embodiment of the invention provides an attachment structurefor coupling subassemblies of a multi-layer printed circuit board, thestructure including a first assembly including a first metal layercarrier including a first blind via including a first capture padpositioned in a top surface of the first metal layer carrier, a firstlaminate adhesive layer positioned along the top surface and the firstcapture pad, and a first via about filled with a conductive materialpositioned in the first laminate adhesive, the first via in contact withthe first capture pad, and a second assembly including a second metallayer carrier including a second blind via including a second capturepad positioned in a top surface of the second metal layer carrier, wherethe first assembly is attached to the second assembly using the firstlaminate adhesive layer such that the first via in the first adhesive isabout aligned with the second capture pad of the second blind via.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flowchart of a sequential lamination process formanufacturing a printed circuit board having stacked vias includingsequential lamination and plating steps.

FIGS. 2 a-2 f illustrate a process for attaching subassemblies to form amulti-layer printed circuit board using internal micro vias positionedin encapsulation and adhesive layers in accordance with one embodimentof the present invention.

FIG. 2 g is a cross sectional view of the finalized multi-layer printedcircuit board of FIGS. 2 a-2 f in accordance with one embodiment of thepresent invention.

FIG. 3 is a cross sectional view of a multi-layer printed circuit boardhaving three subassemblies attached using the process of FIGS. 2 a-2 fin accordance with one embodiment of the present invention.

FIGS. 4 a-4 j illustrate an alternative process for attachingsubassemblies to form a multi-layer printed circuit board using internalmicro vias positioned in an adhesive layer in accordance with oneembodiment of the present invention.

FIG. 5 is a cross sectional expanded view of a subassembly tosubassembly attachment including two blind vias coupled by adhesive andconductive paste to form a thin via in accordance with the process ofFIGS. 4 a-4 j.

FIG. 6 is a cross sectional expanded view of another subassembly tosubassembly attachment including stacked vias on each subassemblycoupled by adhesive and conductive paste to form a via in accordancewith one embodiment of the present invention.

FIG. 7 is a cross sectional expanded view of another subassembly tosubassembly attachment using a conductive paste micro via locatedbetween two mechanically drilled vias having enlarged surface areas inaccordance with one embodiment of the present invention.

DETAILED DESCRIPTION

In the following detailed description, certain exemplary embodiments ofthe present invention are shown and described, by way of illustration.As those skilled in the art would recognize, the described exemplaryembodiments may be modified in various ways, all without departing fromthe spirit or scope of the present invention. Accordingly, the drawingsand description are to be regarded as illustrative in nature, ratherthan restrictive. There may be parts shown in the drawings, or parts notshown in the drawings, that are not discussed in the specification asthey are not essential to a complete understanding of the invention.Like reference numerals designate like elements.

FIG. 1 is a flowchart of a sequential lamination process formanufacturing a printed circuit board having stacked vias includingsequential lamination and plating steps.

FIGS. 2 a-2 f show a process for manufacturing a printed circuit boardincluding attaching laminated subassemblies using internal micro viaspositioned in encapsulation and adhesive layers in accordance with oneembodiment of the present invention.

In FIG. 2 a, the process begins when a laminated subassembly 100 havingfour layers and copper pads (e.g., foil) 102 on both sides is provided.The laminated subassembly 100 further includes two plated or filledthrough hole vias 104. The layers of the subassembly can be made ofmetal, ceramic, or insulating material (e.g., FR4, LCP, Thermount, BT,GPY, such as Teflon, thermally conducting carbon (stablecor), halogenfree, etc., where GPY is a laminate that does not fit in the FR4category, such as polyimide, aziridine cured epoxy, bismalimide, andother electrical grades of laminate). The present invention, however, isnot thereby limited. In other embodiments, other suitable substrate andconductive layer materials can be used. In the embodiment shown in FIG.2 a, the subassembly layers have a thickness ranging from about 3 to 4mils. However, in other embodiments, the subassembly layers and othercomponents can have other suitable dimensions.

In several embodiments, the laminated subassembly 100 can bemanufactured using the process described in FIG. 1. In otherembodiments, the subassembly can be a single lamination subassemblyhaving multiple single metal layer carriers and stacked micro vias.Aspects of single lamination processes for manufacturing circuit boardsare further described in U.S. Pat. No. 7,523,545, U.S. Prov. Pat. Appl.No. 61/189,171, and U.S. patent application Ser. No. 12/772,086 theentire content of each of which is incorporated herein by reference.

In the embodiment illustrated in FIG. 2 a, the laminated subassembly 100includes four metal layers. In other embodiments, the laminatedsubassembly can include more than or less than three metal layercarriers. In the embodiment illustrated in FIG. 2 a, the laminatedsubassembly includes two through hole vias. In other embodiments, thelaminated subassembly can have more then or less than two vias. In otherembodiments, the through hole vias can be replaced with stacked microvias, buried vias, and/or blind vias.

In FIG. 2 b, the process applies an encapsulation material 106 to a topsurface of the laminated subassembly 100 and cures it. In severalembodiments, the encapsulation material is a dielectric material. Inseveral embodiments, the curing is achieved by heating the subassemblyand encapsulation material thereon at a pre-selected temperature for apre-selected duration.

The encapsulation material can be any suitable non-cured insulatingmaterial, including, without limitation, FR4, LCP, Thermount, BT, GPY,such as Teflon, thermally conducting carbon (stablecor), halogen free,etc., where GPY is a laminate that does not fit in the FR4 category,such as polyimide, aziridine cured epoxy, bismalimide, and otherelectrical grades of laminate.

In FIG. 2 c, the process applies a laminate adhesive 108 to a topsurface of the cured encapsulation material 106.

In FIG. 2 d, the process forms holes 110 for micro vias by drillingthrough the laminate adhesive 108 and encapsulation material 106 up to atop surface of the copper pads 102. Each of the micro vias can be formedby laser drilling (and/or mechanical drilling) holes with a diameterranging from about 4 to 10 mils. In other embodiments, other suitabletechniques for forming via holes can be used. In addition, other viasizes can be used.

In FIG. 2 e, the holes 110 are filled with conductive paste therebyforming micro vias 112. In some embodiments, the micro vias are filledwith copper instead of conductive paste. In one embodiment, conductivepaste is used when the via holes are laser drilled and copper is usedwhen the holes are mechanically drilled.

In FIG. 2 f, a second laminated subassembly 200 having copper pads 202on both sides is provided and brought in proximity to the firstlaminated subassembly 100.

FIG. 2 g is a cross sectional view of the finalized multi-layer printedcircuit board of FIGS. 2 a-2 f in accordance with one embodiment of thepresent invention. In FIG. 2 g, the first and second subassemblies (100,200) are brought together and attached. In some applications it can bedifficult to connect and manufacture boards having high aspect ratiovias. By attaching the laminated subassemblies using the processdescribed above, the method of attachment and manufacturing is made mucheasier. In the embodiment illustrated in FIG. 2 g, the process of FIGS.2 b-2 e is performed on the top surface of the first laminatedsubassembly 100. In other embodiments, the process of FIGS. 2 b-2 e isperformed on both the top and bottom surfaces of the laminatedsubassembly 100 to allow for attachment of more than one secondsubassembly 200 to the first subassembly 100.

FIG. 3 is a cross sectional view of a multi-layer printed circuit board300 including three subassemblies attached using the process of FIGS. 2a-2 f in accordance with one embodiment of the present invention. Inother embodiments, more than three subassemblies can be attached usingthe processes of FIGS. 2 a-2 f. The PCB 300 includes three subassemblieshaving multiple copper pads 302 and through hole vias 304. Thesubassemblies are attached by internal micro vias 312 embedded in theencapsulation layers (306-1, 306-2) and adhesive layers (308-1, 308-2).In the embodiment illustrated in FIG. 3, the subassembly to subassemblyattachment is implemented using a micro via filled with a conductivepaste. In other embodiments, the subassembly to subassembly attachmentcan be implemented using a solid copper plated micro via or solid copperthrough hole via.

FIGS. 4 a-4 j illustrate an alternative process for attachingsubassemblies to form a multi-layer printed circuit board using internalmicro vias in accordance with one embodiment of the present invention.

In FIG. 4 a, the process begins when a laminated subassembly 400 havingfour layers and copper pads (e.g., foil) 402 on both sides is provided.The laminated subassembly 400 further includes two plated or filledblind vias 404 coupled to another two plated or filled blind vias 405.The layers of the subassembly can be made of metal, ceramic, orinsulating material (e.g., FR4, LCP, Thermount, BT, GPY, such as Teflon,thermally conducting carbon (stablecor), halogen free, etc., where GPYis a laminate that does not fit in the FR4 category, such as polyimide,aziridine cured epoxy, bismalimide, and other electrical grades oflaminate). The present invention, however, is not thereby limited. Inother embodiments, other suitable substrate and conductive layermaterials can be used. In the embodiment shown in FIG. 4 a, thesubassembly layers have a thickness ranging from about 3 to 4 mils.However, in other embodiments, the subassembly layers and othercomponents can have other suitable dimensions.

In several embodiments, the laminated subassembly 400 can bemanufactured using the process described in FIG. 1. In otherembodiments, the subassembly can be a single lamination subassemblyhaving multiple single metal layer carriers and stacked micro vias.Aspects of single lamination processes for manufacturing circuit boardsare further described in the above referenced patents and patentapplications.

In the embodiment illustrated in FIG. 4 a, the laminated subassembly 400includes four metal layers. In other embodiments, the laminatedsubassembly can include more than or less than three metal layercarriers. In the embodiment illustrated in FIG. 4 a, the laminatedsubassembly includes four blind vias. In other embodiments, thelaminated subassembly can have more then or less than four vias. Inother embodiments, the blind vias can be replaced with through hole,buried vias, and/or stacked vias.

In FIG. 4 b, the process applies an encapsulation material 406 to a topsurface of the laminated subassembly 400 and cures it. In severalembodiments, the encapsulation material is a dielectric material. Inseveral embodiments, the curing is achieved by heating the subassemblyand encapsulation material thereon at a pre-selected temperature for apre-selected duration.

The encapsulation material can be any suitable non-cured insulatingmaterial, including, without limitation, FR4, LCP, Thermount, BT, GPY,such as Teflon, thermally conducting carbon (stablecor), halogen free,etc., where GPY is a laminate that does not fit in the FR4 category,such as polyimide, aziridine cured epoxy, bismalimide, and otherelectrical grades of laminate.

In FIG. 4 c, the process forms holes 410 for micro vias (or vias) bydrilling through the encapsulation material 406 up to a top surface ofthe copper pads 402. Each of the micro vias can be formed by laserdrilling (and/or mechanical drilling) holes with a diameter ranging fromabout 4 to 10 mils. In other embodiments, other suitable techniques forforming via holes can be used. In addition, other via sizes can be used.

In FIG. 4 d, the holes 410 are filled with copper thereby forming solidcopper micro vias 412. In some embodiments, the micro vias 412 arefilled with conductive paste instead of copper. In one embodiment,conductive paste is used when the via holes are laser drilled and copperis used when the holes are mechanically drilled.

In FIG. 4 e, the process images, develops, plates copper, adds resistand strips the resist to form a conductive pattern on the encapsulationlayer 406 and on vias 412. The conductive pattern includes capture pads414 positioned on top of vias 412.

In FIG. 4 f, the process applies a laminate adhesive 416 to a topsurface of the cured encapsulation material 406 and the capture pads414.

In FIG. 4 g, the process forms holes 418 for thin micro vias by drillingthrough the laminate adhesive 416 up to a top surface of the capturepads 414. Each of the thin micro vias can be formed by laser drilling(and/or mechanical drilling) holes with a diameter ranging from about 1to 3 mils. In other embodiments, other suitable techniques for formingvia holes can be used. In addition, other via sizes can be used.

In FIG. 4 h, the holes 418 are filled with conductive paste therebyforming micro vias 420.

In FIG. 4 i, a second laminated subassembly 400-2 having substantiallysimilar features on one surface thereof to the first subassembly 400 ofFIG. 4 e, including two blind solid copper micro vias with conductivepads positioned thereon, is formed and aligned such that the thinconductive paste filled micro vias of the first laminated assembly 400and corresponding conductive pads of the second laminated assembly 400-2will be physically and electrically coupled when they are broughttogether for attachment, and secured by the laminate adhesive 416.

FIG. 4 j is a cross sectional view of the finalized multi-layer printedcircuit board of FIGS. 4 a-4 i in accordance with one embodiment of thepresent invention. In FIG. 4 j, the first and second subassemblies (400,400-2) are brought together and attached. In some applications it can bedifficult to connect and manufacture boards having high aspect ratiovias. In some applications, complex via structures can be too difficultto manufacture using traditional manufacturing methods. By attaching thelaminated subassemblies using the process described above, the method ofattachment and manufacturing is made much easier. In addition, theconductive paste or conductive ink micro via between the laminatedsubassemblies is very thin (e.g., 3 to 5 mils). While not bound by anyparticular theory, the thin micro via or joint can provide good highfrequency conductivity. In several embodiments, the electricalconductivity of the joint is not as good as a highly conductive metalsuch as copper. However, because the joint is thin, it can provide thegood conductivity for signals having high frequency characteristics(e.g., radio frequency type signals and the like). In addition, the thincopper paste joint can provide minimal disruption to the electricalcurrent flowing therethrough.

In embodiments illustrated in FIGS. 4 a-4 j, the process is performed onthe top surface of the first laminated subassembly 400. In otherembodiments, the process of FIGS. 4 a-4 j is performed on both the topand bottom surfaces of the laminated subassembly 400 to allow forattachment of more than one second subassembly 400-2 to the firstsubassembly 400.

In several embodiments, the conductive paste or conductive ink caninclude a mixture of copper and tin. In other embodiments, othersuitable conductive materials can be used for the conductive paste.

FIG. 5 is a cross sectional expanded view of a subassembly tosubassembly attachment 500 including two blind vias (512-1, 512-2)coupled by adhesive (not shown) and conductive paste 520 to form a thinvia in accordance with the process of FIGS. 4 a-4 j. Each of the blindvias (512-1, 512-2) includes conductive pads (502-1, 502-2) on outersurfaces thereof and conductive pads (514-1, 514-2) on inner surfacesthereof. The conductive paste structure 520 forms a thin micro viawithin the adhesive (see FIG. 4 j), which can have the desirableproperties discussed above.

FIG. 6 is a cross sectional expanded view of another subassembly tosubassembly attachment 600 including stacked vias (602, 604) on eachsubassembly coupled by adhesive (not shown) and a conductive paste via606 in accordance with one embodiment of the present invention. Ascompared to the subassembly attachment of FIG. 5, the conductive pastevia 606 is substantially taller (e.g., z-axis length). This taller formof the conductive paste via can be easier to manufacture and providesgood control of the impedance between board layers.

FIG. 7 is a cross sectional expanded view of another subassembly tosubassembly attachment 700 using a conductive paste micro via 702located between two mechanically drilled vias (704, 706) having enlargedsurface areas (708, 710) in accordance with one embodiment of thepresent invention.

While the above description contains many specific embodiments of theinvention, these should not be construed as limitations on the scope ofthe invention, but rather as examples of specific embodiments thereof.Accordingly, the scope of the invention should be determined not by theembodiments illustrated, but by the appended claims and theirequivalents. For example, while certain components have been indicatedto be formed of copper, other suitable conductive materials may be usedinstead of copper.

1. A method of manufacturing a printed circuit board comprising:attaching a plurality of metal layer carriers to form a firstsubassembly comprising at least one copper foil pad on a first surface;applying an encapsulation material onto the first surface of the firstsubassembly; curing the encapsulation material and the firstsubassembly; applying a lamination adhesive to a surface of the curedencapsulation material; forming at least one via in the laminationadhesive and the cured encapsulation material to expose the at least onecopper foil pad; attaching a plurality of metal layer carriers to form asecond subassembly; and attaching the first subassembly and the secondsubassembly.
 2. The method of claim 1, further comprising: attaching aplurality of metal layer carriers to form a third subassembly comprisingat least one copper foil pad on a first surface; applying a secondencapsulation material onto the first surface of the third subassembly;curing the second encapsulation material and the third subassembly;applying a second lamination adhesive to a surface of the cured secondencapsulation material; forming at least one via in the secondlamination adhesive and the second cured encapsulation material toexpose the at least one copper foil pad of the third subassembly; andattaching the third subassembly and the first subassembly.
 3. The methodof claim 1, wherein the forming at least one via in the laminationadhesive and the cured encapsulation material to expose the at least onecopper foil pad comprises: drilling at least one hole in the laminationadhesive and the cured encapsulation material; filling the at least onehole with a conductive paste.
 4. The method of claim 3, wherein theconductive paste comprises a material comprising one or more metals. 5.The method of claim 3, wherein the conductive paste comprises aconductive ink.
 6. The method of claim 1, wherein the attaching thefirst subassembly and the second subassembly comprises: aligning the atleast one via with a pad on the second assembly; attaching the firstsubassembly and the second subassembly using the laminate adhesive,wherein the via and the pad are electrically coupled.
 7. The method ofclaim 1, wherein the via is a micro via.
 8. A method of manufacturing amulti-layer printed circuit board comprising: forming a firstsubassembly comprising: (a) attaching at least one metal layer carrierto form a first subassembly comprising at least one copper foil pad on afirst surface; (b) applying an encapsulation material onto the firstsurface of the first subassembly; (c) curing the encapsulation materialand the first subassembly; (d) forming at least one first via in thecured encapsulation material to expose the at least one copper foil pad;(e) forming a conductive pattern on a surface of the cured encapsulationmaterial, the conductive pattern including a conductive pad coupled tothe at least one first via; (f) applying a lamination adhesive to thesurface of the cured encapsulation material; (g) forming at least onehole in the lamination adhesive proximate the at least one first via;(h) filling the at least one hole with a conductive material to form atleast one second via; repeating (a) through (e) to form a secondsubassembly; attaching the first subassembly and the second subassemblysuch that the at least one second via of the first subassembly is aboutaligned with the conductive pad of the second subassembly.
 9. The methodof claim 8, wherein the at least one first via of the first subassemblyis a blind via, and wherein the at least one first via of the secondsubassembly is a blind via.
 10. The method of claim 8, wherein the atleast one first via of the first subassembly is electrically coupledwith the at least one first via of the second subassembly.
 11. Themethod of claim 8, wherein the at least one first via is about filledwith copper.
 12. The method of claim 8, wherein the forming the at leastone first via in the cured encapsulation material to expose the at leastone copper foil pad comprises: drilling at least one first hole in thecured encapsulation material; and filling the at least one first holewith copper.
 13. The method of claim 8, wherein the forming theconductive pattern on the surface of the cured encapsulation materialcomprises forming a conductive pad on at least a portion of the firstvia.
 14. The method of claim 8, wherein the conductive materialcomprises one or more metals.
 15. The structure of claim 14, wherein theconductive material comprises a material selected from the groupcomprising copper and tin.
 16. The method of claim 8, wherein theconductive material comprises a conductive ink.
 17. An attachmentstructure for coupling subassemblies of a multi-layer printed circuitboard, the structure comprising: a first assembly comprising a firstmetal layer carrier comprising: a first blind via including a firstcapture pad positioned in a top surface of the first metal layercarrier, a first laminate adhesive layer positioned along the topsurface and the first capture pad, and a first via about filled with aconductive material positioned in the first laminate adhesive, the firstvia in contact with the first capture pad; and a second assemblycomprising a second metal layer carrier comprising a second blind viaincluding a second capture pad positioned in a top surface of the secondmetal layer carrier, wherein the first assembly is attached to thesecond assembly using the first laminate adhesive layer such that thefirst via in the first adhesive is about aligned with the second capturepad of the second blind via.
 18. The structure of claim 17, wherein thefirst blind via and the second blind via comprise copper.
 19. Thestructure of claim 18, wherein the first blind via and the second blindvia are about filled with copper.
 20. The structure of claim 18, whereinthe conductive material comprises one or more metals.
 21. The structureof claim 20, wherein the conductive material comprises a materialselected from the group comprising copper and tin.
 22. The structure ofclaim 17, wherein the conductive material comprises a conductive ink.23. The structure of claim 17, wherein a thickness of the first via inthe first adhesive is about 3 to 5 mils.